We build electronics that survive
tell us where
We make rad-hard electronics. Built to survive every environment that breaks ordinary chips.
* All specifications subject to testing.
Within the radiation.
Our chips sit next to the sensor and turn signals into data at the source.
- Analogue-to-digital front endsTurn sensor signals into data at the sensor.
- Digitisation architectureCarry many signals on one cable and cut the noise.
- Local processingHandle data where the radiation is.
We work in wide-bandgap electronics.
Ionising radiation damages chips in two ways.
- Single event upset. A single particle can free enough charge to flip a stored bit.
- Trapped charge. Over time, ionising dose leaves charge trapped in a transistor’s insulator until the gate switches on by itself.
A wider bandgap means each strike frees fewer charges, so the transistor holds its state.
Illustrative. The same strike frees fewer charges in a wide-bandgap material.
Illustrative. Stronger bonds take more energy to knock an atom out of place.
Neutrons knock atoms out of place.
A neutron carries no charge, so it passes through until it hits an atom head on. The impact knocks the atom out of the crystal, and that atom can knock out more. This is displacement damage, and fusion makes neutrons in vast numbers.
Wide-bandgap crystals have stronger bonds, so it takes more energy to knock an atom loose.
Today’s rad-hard chips are built for space.
Fusion brings much higher ionising radiation, along with extreme numbers of neutrons. Hardened silicon handles power and sensing but gives out early. Wide-bandgap switches go further but only handle power. Neither is built for fusion.
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Silicon, hardened by designAbout 83% of today’s rad-hard market.RunningPowerSensing and data
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Wide-bandgap power switchesSwitch power only, with no sensor electronics.RunningPowerNo sensing
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C3 SystemsBuilt for neutron damage and ionising dose.RunningPowerSensing and data
Illustrative, not to scale. Our figures are targets, subject to testing. Market share: MarketsandMarkets, 2026.
From assembly to components.
Today we build by hand. Next we develop our own technology. Later we ship it ready to use.
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Now
Discrete work
We design and downselect components, and design boards built to each customer’s requirements.
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Next
Research and development
We design our own wide-bandgap building blocks and test them under radiation.
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Later
Components for the world
Chips made to our own designs, or to other businesses’ designs, shipped wherever they’re needed.